Koh Young Highlighting 3D Inspection for Advanced Packaging at SEMICON Japan 2025 in Tokyo Big Sight
Seoul, Korea – Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, will showcase its latest semiconductor inspection portfolio at SEMICON Japan 2025, held from December 17 to 19 at Tokyo Big Sight in Booth E5528. This year’s exhibit highlights Koh Young’s commitment to delivering production-speed and high-precision inspection solutions […]
Global Electronics Association Launches Sustainability Reporting Toolkit
The Global Electronics Association Launches Double Materiality Assessment Toolkit to Support the Electronics Industry with Sustainability Reporting Compliance the Global Electronics Association announced the release of its Double Materiality Assessment (DMA) Toolkit, designed to help companies efficiently navigate the complex reporting requirements of the Corporate Sustainability Reporting Directive (CSRD). Although the CSRD is an EU […]
Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power, Says TrendForce
TrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance. The PCB industry is officially entering […]
Eco-Friendly PCB Manufacturing: Strategies for Reducing Environmental Impact through LCA
In this article, Layla Avagyan of Armenian PCB manufacturer HyePeak explores the best practices for sustainability in PCB manufacturing, the role of LCA, its advantages, and the challenges faced along the way.