Indium Corporation Experts to Present on Power Electronics at Productronica 2025
As one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany. Tuesday, November 18 Novel Solder Alloy Systems Offering High Reliability and Reduced Process Temperatures in PCB Soldering by Senior Technical […]
India’s Smartphone Market Hits Five-Year High in Festive Q3 2025, Up 4% YoY on Premium Demand
IDC: India smartphone market grows 4% in Q3 2025, led by premium segment; Apple reaches a record 5M units at fourth position for the first time. INDIA – India’s smartphone market reached a five-year high in the festive third quarter of 2025 (3Q25), growing 4.3% year-over-year (YoY) to 48 million units, according to the International Data […]
Enginuity Calls for Urgent Action to Make Apprenticeships Affordable in Upcoming U.K. Budget
Supporting Apprenticeships: A Critical Investment in the Future of UK Industry Enginuity, the UK’s leading skills body dedicated to closing the skills gap in engineering and manufacturing, is urging the Government to take decisive steps in the Budget to restore the affordability of apprenticeships, or risk reducing growth for good. Recent years have seen a […]
Mycronic presents the next level of flexible PCB assembly at Productronica 2025
Mycronic is a leading Sweden-based electronics assembly solutions provider and invites visitors to explore their next innovations and discover the factory of the future at Productronica 2025, November 18–21 in Munich, at booth A3.249. Attendees can experience Mycronic’s latest innovations and new product launches to flex their manufacturing flow. Mycronic experts in printing, placement, inspection, material handling, and […]
Flex Expands Liquid Cooling Footprint at Equinix Co-Innovation Facility
New rack-level demonstration in Ashburn, Virginia showcases scalable, high-density, and sustainable cooling for next-generation compute environments News summary Demonstration showcases standalone and facility-integrated single-phase direct liquid cooling (DLC) capabilities incorporated into a single OCP ORv3 rack DLC solution reduces data center water and power consumption significantly in AI and high-performance computing (HPC) environments AUSTIN, Texas, […]