EMC Taiwan Receives IPC-4101 Qualified Products Listing Certification
IPC’s Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Elite Materials Co. (EMC), an electronics base material manufacturing company headquartered in Taoyuan City, Taiwan. EMC produces copper-clad laminates, prepregs, and packaging substrates to the global electronics industry. EMC successfully qualified their product EM-371(Z) to specification sheet 126 of IPC-4101E WAM1, Specification for Base Materials […]
Global Perspectives: How New Tariffs Are Shaping the Electronics Industry
By Sandy Gentry, Global Electronics Association Recent tariff announcements — spanning country-specific measures to copper foil and semiconductors — are reshaping markets and impacting the electronics industry. Global Electronics Association leaders share perspectives from their regions on what these changes mean. Europe: Sanjay Huprikar, Chief Global Officer In late July, the United States and […]
Active-PCB Strengthens Quality Assurance with Koh Young 3D AOI
This case study from Active-PCB, a complex PCB manufacturer based in Redding, UK, highlights the value of working with Koh Young to raise the bar on inspection performance by expanding its investment in Koh Young 3D Automated Optical Inspection (AOI) technology. With a legacy of delivering high-complexity assemblies for small to medium-batch productions since 1997, Active-PCB has earned a strong reputation for its responsive manufacturing solutions and quality-driven approach.
Webinar August 14: U.S. Trade & Tariff Developments – What You Need to Know Now
The Global Electronics Association invites you to a timely and informative webinar on the latest U.S. trade and tariff developments and their implications for the electronics industry. Hosted by Chris Mitchell, the Association’s Vice President of Global Advocacy and Intelligence, the session will feature insights from Ludmilla Kasulke, Partner at Squire Patton Boggs and one […]
Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium in Niskayuna, NY
Atlanta, GA – Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the 36th Annual Electronics Packaging Symposium (EPS), hosted at the GE Aerospace Research Campus in Niskayuna, New York, on September 03-04, 2025. Organized by the Binghamton University Integrated Electronics […]