TSMC Reportedly to Break Ground on U.S. Advanced Packaging Plants in 2028, Starting with SoIC
As TSMC accelerates its U.S. expansion with progress on its third Arizona fab, it still has to ship cutting-edge chips—like those for NVIDIA—back to Taiwan for advanced packaging. But that’s set to change. According to MoneyDJ, the foundry giant plans to break ground on two advanced packaging plants in the U.S. in 2028, featuring SoIC (System-on-Integrated-Chips) […]