Statement on Clean Industrial Deal and Omnibus Package
The high regulatory and administrative burden in Europe has led to a decline in European competitiveness for the electronics industry in recent years. IPC has long advocated for a 25% reduction in regulations and smarter policies that drive both sustainability and industrial growth. The European Commission’s new omnibus regulations and Clean Industrial Plan are steps […]
Mouser Shipping Nordic Semiconductor’s Thingy:91 X Prototyping Platform for Wireless IoT Applications
Mouser Electronics, Inc. is now shipping the new Thingy:91 X™ Prototyping Platform from Nordic Semiconductor. The Thingy:91 X is an easy-to-use, battery-operated prototyping platform for cellular Internet of Things (IoT) proof-of-concept (PoC) demos and initial cellular IoT device development for logistics, asset tracking, smart city, predictive maintenance, industrial and wearable applications. The Nordic Semiconductor Thingy:91 X, available from Mouser, is designed to address the needs of […]
SEMI Energy Collaborative Releases Recommendations for Building Low-Carbon Energy Supply in Singapore
MILPITAS, Calif. — The SEMI Energy Collaborative publicly released its analysis and report: Challenges and Potential Solutions for Acceleration of Low-Carbon Energy Deployment in Singapore. Now available for download, the report combines input from SEMI and its Energy Collaborative sponsors and suggests solutions for policymakers, low-carbon energy (LCE) developers, and semiconductor industry companies to further increase the pace […]
Up Close with Roberto Gatti, CEO, Delvitech SA
EMSNOW discusses Delvitech’s inspection system platform with the company’s CEO Roberto Gatti. Delvitech will showcase its groundbreaking Horus system, an all-in-one AI native platform for both Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI), at the upcoming IPC APEX Expo 2025 in Anaheim. The software/hardware systems are fast, fully integrated and agnostic to what […]
2025 IEEE Electronic Components and Technology Conference May 27-30 Highlights Microelectronics Packaging and Component Breakthroughs
Premier electronics packaging conference celebrates 75 years of serving the industry Key topics include heterogeneous integration, hybrid bonding, ultra-dense interconnections, photonic devices An expanded number of special sessions on critical technologies A Student and Startup Innovation Challenge DALLAS, TX – More than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components […]