IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
BANNOCKBURN, Ill., USA – The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.” […]
Quantum Computing: Commercial Revenue to Near $10bn Globally by 2030
Basingstoke, UK – A new study from Juniper Research, has found quantum technology commercial revenue will rise from $2.7 billion in 2024 to $9.4 billion in 2030. However, the study also predicts the number of quantum computers deployed by 2030 will only reach approximately 300, reflecting the very early stage of the market and high set-up […]