SEMI Energy Collaborative Releases Analysis and Recommendations for Increasing Supply of Low Carbon Energy in South Korea

MILPITAS, Calif. – In an effort to help the global semiconductor value chain lower greenhouse gas (GHG) emissions, the industry association SEMI released today its first region-specific analysis of current and forecasted low-carbon energy (LCE) markets for South Korea. Developed by the SEMI Energy Collaborative (EC) and its sponsors, with insights from partner organizations and the South Korean […]

Fonon Additive Manufacturing: Bringing High-Tech to Rail Transport Industry

Transport Manufacturers Find Financial and Environmental Advantages With 3D Laser Printing ORLANDO, Fla.–(BUSINESS WIRE)–Fonon Corporation’s Bulk-To-Shape (BTS) additive manufacturing technology, currently in development stage, is poised to streamline sectors of the rail transport industry, which often suffers from supply chain issues. With BTS, rail transport manufacturers can replace low-volume metal components with 3D printed parts […]

2025 IEEE Electronic Components and Technology Conference Announces Call for Papers

DALLAS, TX – The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference’s 75th anniversary. The 75th annual ECTC will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. […]

TSMC Arizona struggles to overcome vast differences between Taiwanese and US work culture

SOURCE: Tom’s Hardware Taiwan Semiconductor Manufacturing Company (TSMC), one of the world’s largest advanced computer chip manufacturers, continues finding its efforts to get its Arizona facility up and running to be more difficult than it anticipated. The chip maker’s 5nm wafer fab was supposed to go online in 2024 but has faced numerous setbacks and now isn’t […]