Correction release: Inside information, positive profit warning: Incap’s revenue and EBIT higher than anticipated in 2024
Incap corrects its inside information release published on 18 July 2024 at 9:00 a.m. EEST regarding the outlook for 2024. The title of the English release incorrectly stated 2014 when it should be 2024. The original title was: “Inside information, positive profit warning: Incap’s revenue and EBIT higher than anticipated in 2014”. The corrected release is […]
Winners of 2024 IPC Masters Competition China Announced
From July 8-10, the 2024 IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition, was the largest in the history of the Greater China region, bringing nearly 400 electronics industry elites from 18 provinces and municipalities. The event covered diverse industry sectors, including aerospace, automotive electronics, rail transit, consumer electronics, energy, […]
SMTA Board of Directors Election – Deadline to vote is July 31, 2024
Each year the Nominating Committee approves a slate of candidates for board service that best exemplifies SMTA’s membership profile. This year thirteen candidates have been approved for the board of directors election. We ask for your help in electing four officers and one president to continue leading the organization. Members, log in here with […]
Mouser-Backed Formula E Racing Team Heads to London for Final Two Races of the Season
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is excited to cheer on the DS PENSKE Formula E racing team in London, UK, for the final two rounds of the ABB FIA Formula E World championship. Round 15 is set for July 20, while round 16 on July 21 will close out the 2024 […]
Indium Corporation Introduces Au-Based Precision Die-Attach Preforms
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications. Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability […]