U.S. Tariff Hikes Expected to Boost ESS Installation Capacity

The new tariffs imposed by the U.S. target several sectors, including steel and aluminum products, semiconductors, electric vehicles, lithium-ion batteries and their components, critical minerals, solar cells, harbor cranes, and medical products. The tariff rates range from 25% to 100%, with electric vehicles experiencing the largest increase, quadrupling their previous rate. These tariffs will take […]

Chips JU concludes the selection of four new pilot lines to be implemented in Europe

Chips Joint Undertaking (Chips JU) announced last month the successful evaluation of the submitted innovative semiconductor pilot line proposals and has started negotiations with four consortia, aiming at signing the relevant agreements later this year. The step promises to catalyse innovation in the region and reinforce Europe’s technological leadership on the global stage. The Public […]

New SEMI Foundation Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce

MILPITAS, Calif.  — The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+ inclusion in the semiconductor workforce. Semiconductor PRIDE (Semiconductor Professionals for Respect, Inclusion, Diversity, and Equity) will focus on LGBTQ+ hiring, STEM outreach, mentorship and fostering greater inclusion and belonging at semiconductor workplaces. The announcement comes as the world celebrates Pride Month in […]

Indium Corporation to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium

Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20. Indium Corporation is a leading solder supplier for laser and optical applications. Gold-based alloys are a great choice to ensure the best performance and reliability possible for applications […]