Seven Fabs Might Face a Delay in Construction, Reports Trendforce

In the past two years, the semiconductor industry has experienced a market downturn, a recovery slower than expected, and a cash crunch. Major companies such as Intel, TSMC, and Samsung, while continuing to advance their expansion projects, have been constantly adjusting and slowing down the pace and schedule of their fab construction to better serve […]

Panel at 2024 IEEE Electronic Components and Technology Conference (ECTC) Explores the Impact of Industry-Government Co-Investments in Advanced Packaging Around the World

DENVER, CO  – Governments around the world are pursuing a growing number of co-investment programs with the microelectronics packaging and semiconductor industries, in order to build and expand infrastructure in their own jurisdictions. In a special session at the 2024 IEEE Electronic Components and Technology Conference (ECTC), representatives from Canada, the European Union, India, Korea and the […]