High-End AI Server Demand from North America’s Top Four CSPs Expected to Exceed 60% in 2024, Says TrendForce
TrendForce’s newest projections spotlight a 2024 landscape where demand for high-end AI servers—powered by NVIDIA, AMD, or other top-tier ASIC chips—will be heavily influenced by North America’s cloud service powerhouses. Microsoft (20.2%), Google (16.6%), AWS (16%), and Meta (10.8%) are predicted to collectively command over 60% of global demand, with NVIDIA GPU-based servers leading the […]
Mouser Electronics to Empower Innovation for All at AMPER 2024
Global Authorised Distributor to Exhibit at Booth F 2.08 Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, will empower innovation at this year’s AMPER exhibition at the Exhibition Centre in Brno, Czech Republic. From 19 to 21 March, electrical engineering experts and the wider community will […]
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at productronica China
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, IndiumCorporation® is proud to showcase its high-reliability alloys and soldering solutions at productronica China, March 20-22, in Shanghai. With nearly a decade of experience in EV manufacturing and more than 10 million EVs on the road with its innovative materials, Indium Corporation will […]
Cicor acquires Evolution Medtec Srl and strengthens its engineering capabilities in the Medtech sector
Bronschhofen – The Cicor Group (SIX Swiss Exchange: CICN) has acquired 100% of the shares of the Romanian engineering company Evolution Medtec Srl and is further expanding its engineering capabilities in the medical technology sector. Evolution Medtec is a provider of comprehensive engineering services with a strong focus on medical and paramedical applications. The company […]
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies
Washington, D.C., – IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. “IPC applauds this very important milestone in the work to […]