SIA Commends Introduction of Bipartisan Legislation to Restore Immediate Deductibility of R&D Investments
WASHINGTON—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in Congress of bipartisan legislation to restore full tax deductibility of R&D investments. The legislation, the American Innovation and Jobs Act, was introduced in the Senate by Sens. Maggie Hassan (D-N.H.) and Todd Young (R-Ind.) […]
Smartphone Camera Module Output Predicted to Grow to 4.62 Billion Units in 2023 as Smartphone Demand Picks Up, Says TrendForce
Falling global smartphone production brought about by high inflation and China’s COVID policies resulted in only 4.46 billion camera modules being manufactured in 2022. However, as the global economy is slowly set to stabilize in 2023, smartphone production is also projected to rise by 0.9%. Furthermore, increased production of camera lenses for budget smartphones means […]
Chancellor announces over £2.5 bn in Tech R&D: will it suffice to bolster UK tech economy following Sillicon Valley Bank collapse?
British Chancellor of the Exchequer, Jeremy Hunt, announced the government’s plan to solidify Britain’s position in the global tech landscape. Among his 4 E’s – Enterprise, Education, Employment and Everywhere – to boost growth, the chancellor has announced the launch of an AI sandbox – committing £900 million to implementing recommendations for an exascale computer. […]
Jabil Posts Second Quarter Results
Positive Momentum Expected to Continue ST. PETERSBURG, Fla.–Jabil Inc. (NYSE: JBL), reported preliminary, unaudited financial results for its second quarter of fiscal year 2023. “The Jabil team delivered another outstanding quarter, highlighted by excellent operational execution and solid revenue growth,” said Chairman and CEO Mark Mondello. “Our diversified portfolio allowed us to successfully navigate a […]
Indium Corporation to Host Webinar on Optimizing sTIM Processes for HIA on March 30
Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company’s InSIDER Series, will be held live at 2:00 p.m. (EST), March 30, and made available for on-demand viewing afterward. Reflowed indium metal has for decades been […]