CHIPS Act Implementation Requires Strong Focus on “Advanced Packaging,” Industry Leaders Say
Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission are gathering in Washington, D.C. this week to discuss “the next big thing” […]
EMS@ C-Level – Peter Nilsson, President and CEO of Kitron Group
With 300% growth in the eight years since he took over as President and CEO, Peter Nilsson is understandably proud of Kitron Group. In this detailed but concise interview Peter talks about challenges in the industry, including the pandemic, recent component issues, talent shortages, geopolitics, and much more. We also dig into Kitron’s M&A strategy […]