8-inch Substrate Mass Production in 2H22, 3rd Gen Power Semiconductor CAGR to Reach 48% by 2025, Says TrendForce
At present, the materials with the most development potential are Wide Band Gap (WBG) semiconductors with high power and high frequency characteristics, including silicon carbide (SiC) and gallium nitride (GaN), which are mainly used in electric vehicles (EV) and the fast charging battery market. TrendForce research estimates, the output value of third generation power semiconductors […]
Japan is World´s number one Robot Maker
iREX Tokyo just started Frankfurt, Tokyo – Japan is the world´s number one industrial robot manufacturer – delivering 45% of the global supply. In recent years, the country’s robot suppliers have increased their production capacity considerably: Their export ratio rose to 78% in 2020, when 136,069 industrial robots were shipped. These are results published […]
Codasip University Program spurs innovation for processor engineers
Keith Graham appointed Head of University Program Munich – Codasip, the leader in processor design automation, has launched a University Program to help the next generation of processor engineers to Design for Differentiation and to solve tomorrow’s technological challenges. The Program augments graduate and undergraduate computer engineering curriculums with materials and assignments, and by granting […]
Indium Corporation to Feature Liquid Metal Thermal Solutions at SEMI-THERM
Indium Corporation will feature products from its line of proven gallium-based liquid metal thermal solutions at SEMI-THERM, March 21-25, San Jose, Calif., U.S. Indium Corporation is a leader in high-performance liquid metal-based thermal interface materials (TIM) with advanced knowledge and experience in high-volume TIM0, TIM1, and TIM2 applications. Indium Corporation’s Gallitherm™ portfolio of gallium-based liquid […]
MacDermid Alpha Launches ALPHA® OM-565 HRL3, Next Generation, Low Melt Point Solder Paste
Waterbury, CT USA – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, announces the launch of ALPHA OM-565 HRL3, next generation, high reliability low temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced […]