Indium Corporation Expert to Participate in iNEMI Technical Series

Indium Corporation’s Tim Jensen, global account manager and senior thermal technologist, will participate in the International Electronics Manufacturing Initiative’s virtual Packaging Tech Topic series, offering his insights into the increased adoption of metal thermal interface materials (TIMs) in high-performance computing at 8 a.m. New York/2 p.m. Berlin/9 p.m. Beijing on Tuesday, March 8. Managing heat […]

MacDermid Alpha Presents Sinter Technology Technical Paper at APEC Power Electronics Conference 2022

Waterbury, CT USA– The Power Electronics Division of MacDermid Alpha Electronics Solutions, a global leader of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in power electronics packaging and assembly, will be presenting the technical paper “Automotive Traction Module Attach by Silver Sintering – Process, Performance, and Reliability”at the APEC […]

ECIA Publishes Design Registration Phase 2 Document

Results of Research and Desired-Future State Model   Atlanta – ECIA’s Global Industry Practices Committee (GIPC) has taken on the task of modernizing the channel’s design registration (“d-reg”) process. Assembling a group of Subject Matter Experts (SMEs) and industry stakeholders representing the entire component channel including semiconductors, electromechanical and passives, the group has designed a […]