Sudden Drop in Cryptocurrency Prices Hurts Graphics DRAM Market in 3Q21, Says TrendForce
The stay-at-home economy remains robust due to the ongoing COVID-19 pandemic, so the sales of gaming products such as game consoles and the demand for related components are being kept at a decent level, according to TrendForce’s latest investigations. However, the values of cryptocurrencies have plummeted in the past two months because of active […]
A post-quantum chip with hardware trojans: Chip with secure encryption will help in fight against hackers
A team at the Technical University of Munich (TUM) has designed and commissioned the production of a computer chip that implements post-quantum cryptography very efficiently. Such chips could provide protection against future hacker attacks using quantum computers. The researchers also incorporated hardware trojans in the chip in order to study methods for detecting this type […]
Indium Corporation Announces SMTA South China Presentations
Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center. Leo Hu, senior area technical manager, Area Technical Managers Seven Liang and Geoff Wang, and Evan Yin, assistant manager for Indium Corporation’s Process Simulation Lab in Suzhou, will share […]
ECIA Posts Latest Channel Channel Podcast: Foundation Chair Jim Kaplan
Atlanta – ECIA is pleased to announce that the latest Channel Channel Podcast is now available, featuring ECIA President David Loftus’ interview with ECIA Foundation President Jim Kaplan. The two discuss PACE E-learning, an exciting new ECIA Foundation initiative that will launch this fall to address the need for industry training programs. “Jim Kaplan’s passion for this industry […]
Wafer-Level Packaging Symposium Announced
Minneapolis, MN – The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is “Advanced Packaging: The Dawn of a New Era.” The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements. Addressing wafer-level packaging, […]