Indium Corporation Introduces New Ball-Attach Flux
Indium Corporation continues to expand its flux portfolio with WS-823—a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process […]
Top-15 Semi Companies Log Year-Over-Year Growth of 21% in 1Q21, Reports IC Insights
Excluding Intel, the group would have shown a 29% jump in 1Q21/1Q20 sales. IC Insights released its May Update to the 2021 McClean Report last week. This Update included a discussion of the 1Q21 IC industry market results, an updated quarterly forecast for the remainder of this year, and a look at the top-25 1Q21 semiconductor suppliers. The top-15 1Q21 semiconductor […]