2H20 Growth Expectations Vary Among Leading IC Suppliers

TSMC continues to reap the benefits of strong demand for 7nm and 5nm devices. As expected, most IC suppliers experienced weaker demand and generally poor sales results in the first half of this year due to the Covid-19 pandemic and strained U.S./China trade relations.  However, as reported in IC Insights’ August Update to the 2020 McClean Report, some […]

Cyber Security Special, with Chintan Sutaria and Matt Konda

Cyber security is critical to the successful application of cloud based software and as-a-service business models. In this panel discussion hosted by industry journalist Philip Stoten, CalcuQuote founder and CEO Chintan Sutaria and SecurityProgram.io CEO Matt Konda share their insight and experience with building security into the CalcuQuote suite of products.

Würth Elektronik presents the WE-TGF thermoconductive gap filler

  Conducts heat, not current Waldenburg (Germany) – With its WE-TGF (Thermal Gap Filler) Würth Elektronik now offers a new solution for heat dissipation. The outstanding feature of the self-adhesive gap-filler material: The non-conductive barrier with a high dielectric strength has a high thermoconductivity index of 1 W/(m*K). The material easily adapts to the differing […]

BrainChip and VORAGO Technologies Agree to Collaborate through the AkidaTM Early Access Program

Agreement to Support Phase I of NASA Program for Radiation-Hardened Neuromorphic Processor Aliso Viejo, California – BrainChip Holdings Ltd (ASX: BRN), a leading provider of ultra-low power high performance AI technology, today announced that VORAGO Technologies has signed the Akida Early Access Program Agreement. The collaboration is intended to support a Phase I NASA program […]