Eric Miscoll and Juan Arango of Koh Young at APEX 2020

Juan updates Eric on how 2020 is shaping up for Koh Young Americas. “Last time we had an election year in the U.S., I told Dr. Koh to prepare for a slower second half, and that year we had the best year we ever had. Dr Koh said  Juan you missed [your  lower forecast]. I […]

iNEMI Announces Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project

Phase 2 End-of-Project / Phase 3 Call-for-Participation Webinar March 5, 2020 The fine pitch substrate features of advanced packaging technologies such as SiP, 2.5D, etc., can directly impact yield and performance of the package. iNEMI’s Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology project has been organized to address the need to identify and characterize the capabilities […]