Semiconductor R&D To Nudge Higher Through 2024, Reports IC Insights
Technical challenges including the move to EUV lithography, sub-3nm process technology, 3D die-stacking technologies, and advanced packaging are expected to lift R&D growth rates. The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex […]
Movie Monday: Cogiscan and SAKI talk Partnership
When inspection data meets connectivity it can be processed to add value for users, that’s why SAKI chose Cogiscan as their connectivity partner. SCOOP’s Philip Stoten is joined by SAKI Corporation’s President, Nori Koike and Deputy General Manager of SAKI Europe GmbH, Jaroslav Neuhauser and Mitch DeCaire, Director of Business Development for Equipment Partnerships at […]