EMS 2.0: What’s next for electronics manufacturing?
By Pradeep Chakraborty A typical electronics manufacturing assembly line generally consists of inspection, mechanical assembly, ICT, x-ray, post-SMT, automated optical inspection (AOI), reflow, PnP, solder paste inspection (SPI) and printer. Today’s electronics product marketplace is somehow off-balance. Plant managers are feeling the pain. Key drivers of supply shortage include massive labor shortage and political instability. […]
The Connectivity Files – A Series of Six Interviews – Brian D’Amico of Mirtec Corporation
Over the coming weeks, we’ll be publishing interviews conducted with experts involved in the deployment and development of smart factory solutions to get their view on the key issues surrounding connectivity. The third interview is with Brian D’Amico – President of Mirtec Corp.
Anders Gets Early Access to Important New Embedded Boards
CompuLab’s i.MX 8 System-on-Module family delivers true heterogeneous multicore processing and is ready to kick-start your next project. What are the Most Important Features of the New i.MX 8 Family? With each new generation, the leading Arm®-based application processors deliver increased performance on a power budget that appeals to designers facing tough constraints such as […]
Shinry Automates Automotive Application with Universal’s Uflex
Automation solution streamlines complex assembly challenges to improve productivity and yield. Shinry Technologies is a leading global Tier 1 supplier of high-voltage Charging and Power Distribution solutions for the electric “new energy vehicle” industry. The company has purchased an assembly line comprised of three Universal Instruments Uflex® automation platforms. The new line will enable Shinry […]
SMTA Announces Call for Participation for 2020 Events
Minneapolis, MN – SMTA announced that abstracts are now accepted for several technical conferences taking place in 2020. All submissions must be strictly technical with focus on technology research and minimize marketing content. The following events are all currently soliciting abstracts: Electronics in Harsh Environments Conference Abstracts Deadline: December 9, 2019 International Conference on Electronics […]