EMSNOW’s Eric Miscoll with Sal Sparacino, Zestron America at SMTAI 2019
Sal Sparacino, Sales and Marketing Manager, Zestron America sat down with EMSNOW Publisher, Eric Miscoll, to talk about the latest demands and trends along with Zestron’s conference presentation at the SMTAi 2019. Filmed on location at SMTAi 2019 in Rosemont, Illinois.
TTI, Inc. Receives Elite Supplier Designation from Lockheed Martin Aeronautics
Fort Worth, Texas – TTI, Inc., a leading specialty distributor of electronic components, announced today the company has received an Elite supplier award from Lockheed Martin Aeronautics. To achieve Aero Elite status a supplier must maintain 12 months at a 98 percent quality and delivery performance level and perform on more than one program. In […]
U.S. Life Sciences CEOs Face Reality Check on Emerging Tech Investments
After bullish ROI outlook last year on artificial intelligence and other technologies, many CEOs see significant payoff in one-to-three years Life science industry investments in digital transformation, such as artificial intelligence and other emerging technologies, may pay off slower than what was once expected, KPMG’s CEO Outlook found.In last year’s survey, a quarter of U.S. life […]
North American PCB Business Growth Continues
IPC Releases PCB Industry Results for September 2019 IPC — Association Connecting Electronics Industries® announced today the September 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales and orders continued to outpace last year and the preceding month in September. The book-to-bill ratio strengthened to 1.04. Total North American PCB shipments in […]
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs
StratEdge experts available at BCICTS 2019 to analyze your high-frequency packaging needs Santee, Calif – StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces its assembly services for attaching gallium nitride (GaN) and other high-frequency, high-power devices using gold-tin (AuSn) and […]