Indium Corporation Introduces Non-Silicone-Based TIM for Burn-in and Test
Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material designed for burn-in and test applications. HSMF-OS is designed for high insertion capability. Its high tensile strength and soft compliant polymer backing allow it to survive multiple insertions. HSMF-OS has been tested to withstand […]
Trends in the Electronics Market are Driving Both Opportunities and Challenges: How do we address them?
Electronics has become personal…Tech designers and manufacturers have to figure out how they can move from single-part-number, mass production to making flexible custom products manufactured in small lot sizes. But what does this mean for an electronics company now? It means planning and processes have to get smarter. Siemens Digital Industries’ Fram Akiki and Oren Manor explain.
IPC Extends Deadline to Submit Abstracts for 2020 APEX Conference
CALL FOR PARTICIPATION There is still a little time to submit abstracts! What you should know: Slots in the technical program at IPC APEX EXPO 2020 are filling up quickly! Deadline extended for our valued speakers until July 5th After that date, the IPC APEX EXPO call for participation will be closed Submit Abstract […]
The Reading Room – What’s the SCOOP?
After hijacking a space on EMSNOW’s homepage while I guest edited the publication, their esteemed editor, Jennifer Read, has kindly allowed me back on a weekly basis to share some of what I am watching, reading and even listening to. So, here’s a few things I’ve enjoyed this week, some of which you will see […]