Indium Corporation to Feature AuSn Solder Preforms at HiTEN 2019
Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the International Conference and Exhibition on High Temperature Electronics Network(HiTEN), July 8-10, Oxford, United Kingdom. Indium Corporation’s high-temperature AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to […]
U.S. Companies Dominate Worldwide IC Marketshare
China and Taiwan companies register double-digit shares in the fabless segment but very low shares of the IDM IC segment.IC Insights will release its 200+ page Mid-Year Update to the 2019 McClean Report next month. A portion of the Mid-Year Update will examine the trends for worldwide IC company marketshare by headquarters location.Figure 1 shows the 2018 IDM and fabless company […]