IPC Issues Call for Participation for Electronics Materials Forum
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019. The content […]
iNEMI Session at ICEP
Session WA1 / Wednesday, April 17 / Room A / 16:40 – 18:20 Toki Messe, Niigata Japan Be sure to join iNEMI at the International Conference on Electronics Packaging (ICEP) in Japan (April 17-20, 2019). Our session will feature results from three iNEMI projects as well as a report from the 2019 iNEMI Roadmap: Packaging […]
The Reading Room – updated daily
For two weeks, I’m guest editor on EMSNOW, while Jennifer takes a well-earned break! For that period, I’m taking the liberty of posting some daily musings. My day generally starts with my own “reading room”, a quick review of my favorite news sources, usually including this publication. Here’s what caught my eye with this morning’s […]
Brian D’Amico, President & CEO of Mirtec Inc., at APEX 2019
With collaborative robots, or cobots, on their booth and new partnerships announced, Mirtec seems typical of many in seeing collaboration as a key issue, especially when it drives value for all parties, particularly the end user. Brian D’Amico, President & CEO of Mirtec Inc., and SCOOP’s Philip Stoten chat about those trends and partnerships, as […]