Dark Clouds Appear in Sunny Skies, Says SEMI
By Christian G. Dieseldorff SEMI Fab report reveals deepening slowdown for leading-edge investments, but the outlook remains still sunny for mature technologies As 2018 dawned, the semiconductor industry appeared to be poised for a rare fourth consecutive year of equipment investment growth. That rosy outlook is about to change as clouds gather in what until now […]
The Rise of Industrial IoT Drives the Adoption of Predictive Inspection Models in Non-destructive Testing
Growth and revenue opportunities emerge from the advent of new business models, mergers & acquisition activity, finds Frost & Sullivan Rebounding from a two-year slump, the non-destructive test (NDT) inspection services market is undergoing an overall transformation. The convergence of various technologies such as Big Data, predictive analytics, digital twin, cloud computing, and smart factories is enhancing growth opportunities in the market, giving rise […]
Dorigo Systems Integrates Koh Young 3D Solder Paste Inspection System into PCB Assembly Lines
Dorigo Optimizes PCB Assembly Using True 3D Optical Inspection for High Speed Production Burnaby, BC, Canada – Dorigo Systems has integrated the Koh Young KY8030-3 Solder Paste Inspection (SPI) and 3D AOI system into its high speed Printed Circuit Board (PCB) assembly lines providing true 3D optical inspection. Dorigo is one of only a few […]
Motorized Miniature Translation Stage for Motion Control, Newly Released by PI
A new family of compact motorized translation stages is available from PI. December 2018, Auburn, MA –The L-408 linear stage strikes a good balance of load capacity, precision, and low cost. It has applications in research and industry including optics, bio-tech, and assembly of miniature components and photonics instrumentation. New L-408 Linear Stage Compact and Precise PI’s […]
Amkor Offers Optical Package Solutions for Multiple Applications
TEMPE, Ariz.- Amkor Technology, Inc. , a provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications, including LIDAR, […]