Blue Ring Stencil and FTC Solder Identify Key Trends for 2019

Stencil Design Changes: An unintended consequence of increasing solder paste volume for 0201 and 01005 components is the possibility of component float, skew, and tombstoning. This has led to stencil design changes to reduce the solder paste volume specifically for those component types. Use of anti-tombstoning solder paste also helps with these issues.   Solder Usage for High-Reliability: Manufacturing […]

Ventec Completes Phase I of $300k Investment Plan at its German Service Center

Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is pleased to announce completion of the first phase of its USD300k investment drive at its Central European facility in Germany. The initial phase focused on fully upgrading the 650sqm dedicated laminate cutting room […]

Microtronic Announces New Informational Tech Bulletin Series  on Optimizing Semiconductor Macro Defect Wafer Inspection 

Hawthorne, NY  – Microtronic, Inc., a maker of high-speed full-wafer semiconductor macro defect inspection systems, wants to shed new light on a topic that is frequently misunderstood in the industry: macro vs. micro inspection. The company is releasing a new series of free informational tech bulletins entitled Macro Intelligence, addressing the often-underutilized capabilities of macro defect wafer […]

Auto Makers Lead Smart Manufacturing Advances with close to 50% Automation

LONDON, UNITED KINGDOM – The adoption of smart manufacturing technologies is growing in almost all industries within the leading manufacturing countries such as the United States, Japan, and Germany, and the automotive industry has been a pioneer for most technologies in each of them, finds ABI Research, a market-foresight advisory firm providing strategic guidance on the […]