Foxconn says R&D excluded from expense cut plan
From Digitimes>> To clarify concerns raised about its expense cut, Foxconn Electronics (Hon Hai Precision Industry) has maintained that the budget reduction is primarily aiming at business units that have failed to achieve their financial targets and external investments that have not achieved expected profitability. Items that will be cut include expenses for business administration, […]
SEHO Seeking Representatives for the Stannol Flux and Solder Product Line
SEHO North America, Inc., a supplier of complete solutions for soldering processes and automated production lines, announced that the company is now selling fluxes and solder from Stannol GmbH in the U.S. For this range of products, SEHO is seeking manufacturers’ representatives throughout the U.S. For more than 130 years, Stannol has been a reliable […]
TTI Now Stocks MF-USHT and MF-NSHT Series MultiFuse Resettable Fuses
Fort Worth, Texas – TTI, Inc., a specialty distributor of electronic components, is now offering the MF-USHT and MF-NSHT series MultiFuse® resettable fuses from Bourns. The MF-USHT and MF-NSHT Polymer Positive Temperature Coefficient (PPTC), available from TTI Inc., are AEC-Q200 certified and features operating temperatures up to 125 ⁰C. Offered in 1206 and 1210 (3014 and 3024 […]
Why Context Is King When Collecting Data
It’s no secret that data collection is important for generating valuable insight that helps plant managers improve efficiency in industrial systems. However, what seems unknown to many in the industry is the importance of understanding the context of the data being analysed. Here, George Walker, managing director of industrial control and automation provider Novotek UK and Ireland, explains why applying context to your data is the difference between insight and statistical blindness.
New Venture Research Report Breaks Down Advanced IC Packaging Technologies, Materials and Markets
Nevada City, California – New Venture Research (NVR) announces the publication of its latest market research report, the “Advanced IC Packaging Technologies, Materials, and Markets – 2018 Edition.” More than ever before, IC packaging technology is being challenged by two distinct, yet closely linked product trends. On the one hand, consumers demand more powerful electronics […]