Indium Corporation to Feature Low-Voiding Solder Pastes at SMTA International 2018
Indium Corporation will feature its suite of void-reducing, no-clean solder pastes to help customers Avoid the Void® at SMTA International from Oct. 14-18 in Rosemont, Illinois. Indium Corporation’s suite of solder pastes, including Indium8.9HF and Indium10.1, are specially formulated to deliver ultra low-voiding, plus enhanced benefits such as improved response-to-pause, stability, head-in-pillow (HIP) minimization, reliable […]
Koh Young SPI Dispenses Solder Paste for 0402M (01005) Microchips
Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, […]
Gartner 2018 Hype Cycle for the Digital Workplace Classifies Seven Technologies to Reach Mainstream Adoption Within the Next Two to Five Years
Analysts to Examine Customer Engagement and the Future of Work at Gartner Digital Workplace 2018, September 24-25 in London Speech recognition will reach the Plateau of Productivity within the next two years and six other technologies will reach mainstream business adoption in the next two to five years according to the 2018 Gartner, Inc. Hype […]