Revenues for Big Data and Business Analytics Solutions Forecast to Reach $260 Billion in 2022, Led by the Banking and Manufacturing Industries, According to IDC
FRAMINGHAM, Mass. – A new update to the Worldwide Semiannual Big Data and Analytics Spending Guide from International Data Corporation (IDC) forecasts worldwide revenues for big data and business analytics (BDA) solutions will reach $260 billion in 2022 with a compound annual growth rate (CAGR) of 11.9% over the 2017-2022 forecast period. BDA revenues are expected to total […]
Gartner Survey Says Cloud Computing Remains Top Emerging Business Risk
Latest Emerging Risks Report Reveals New Threats To Global Enterprises As Cloud Growth Booms Cloud computing ranks as the top risk concern for executives in risk, audit, finance and compliance, according to the latest survey by Gartner, Inc. While cloud computing presents organizations with novel opportunities, a number of new risks — including cybersecurity disclosure […]
Improve your visual quality control by visually comparing magnified boards to a golden sample
TAGARNO has developed a new app for their digital microscopes, which enables you to capture an image of a golden sample to match next to a live screen image of a circuit board or captured sample image. Use the app to perform first-rate quality control of circuit boards after component placement or reflow. By comparing PCB […]
DELO Presents Solvent-free Activators
Windach, August 16, 2018 | DELO has developed two new activators accelerating the adhesion build-up of metal adhesives such as DELO-ML. They allow speeding up production even without containing solvents, which simplifies work safety measures. Activators reduce the curing time of metal adhesives, which achieve their strength under exclusion of oxygen. However, in contrast to […]
Indium Corporation Features Indium3.2HF Solder Paste for Fine Feature Printing at SEMICON Taiwan
Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2018 September 5-7 in Taipei, Taiwan. Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporation’s Type 6SG powder is ideal for fine feature printing applications. Indium3.2HF offers consistent, repeatable printing performance combined with a long stencil life. In […]