Congress Reaches Agreement on CFIUS Reform Legislation Broadening National Security Reviews and Addressing Emerging Technologies

By Christopher R. Wall, Nancy A. Fischer and Matthew R. Rabinowitz Originally published on the Pillsbury Law Blog House and Senate negotiators have agreed on proposed reforms to the Committee on Foreign Investment in the United States (CFIUS) foreign investment review process, which has been added as Title XVII of the FY2019 National Defense Authorization Act (NDAA). The final […]

Helix’s MxC 200 DC-DC power IC increases efficiency at data centers

By Pradeep Chakraborty Fabless power semiconductor company, Helix Semiconductors, announced that Agility Power Systems (Agility) is using the MxC 200 IC for its innovative, 1kW, high-efficiency 48VDC to 12VDC power converter. Agility designs highly efficient switched capacitor power conversion devices targeted at the data center, solar and electric vehicle markets. As data storage capacity grows […]

Indium Corporation to Feature Indium8.9HF Solder Paste at NEPCON South China

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at NEPCON South China, August 28-30, in Shenzhen, China. Indium8.9HF Solder Paste is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the automotive electronics industry. The Indium8.9HF series delivers no-clean, halogen-free […]

Laird’s SuperCool Thermoelectric Assembly Increases Cooling Performance By Up To 60% 

Designed for refrigeration applications in medical diagnostics and analytical instrumentation, the high-performance SuperCool Series delivers high heat pumping capacity in a small form factor…Laird has launched a high performance thermoelectric assembly (TEA) series for indoor lab environments that offers a higher cooling performance per unit volume than competing systems. The SuperCool Series TEA features a […]