Flex Board Manufacturer Printed Circuits is Now Certified to ISO 9001:2015
Flex and rigid flex circuit board manufacturer, Printed Circuits has received accreditation to the new ISO standard, 2001:2015. “We are very excited to announce that we were just certified to the new ISO standard 9001:2015,” said Ken Tannehill, president and CEO. “Starting in 2000 with our original accreditation to ISO 9000 and the military performance […]
IC Insights Raises 2018 IC Market Forecast from 8% to 15%
Increased expectations for the DRAM and NAND flash markets spur upward revision. The biggest adjustments to the original MR18 IC market forecasts were to the memory market; specifically the DRAM and NAND flash segments. The DRAM and NAND flash memory market growth forecasts for 2018 have been adjusted upward to 37% for DRAM (13% shown […]
Ethernet-based modular remote I/O device from ICP DAS
Amplicon has introduced the new ICP DAS iP-8000-MTCP series to its portfolio of measurement and control products. These cost-effective Modbus TCP I/O expansion units provide users with maximum flexibility when designing a custom data acquisition system that requires the measurement and control of a large number of process signals over an Ethernet network. The iP-8841-MTCP […]
SEMI Says Fab Investment Multi-Year Growth Spree Expected to Continue in 2019
By Christian G. Dieseldorff and Dan Tracy, Industry Research & Statistics Group at SEMI Global fab construction investment will see another strong year based on our latest outlook to 2019. SEMI analysts expect 9 percent growth for fab equipment spending in 2018 and 5 percent in 2019. Fully 82 future facilities/lines with various probabilities are […]
Nordson ASYMTEK Introduces Helios™ Automated Fluid Dispensing Platform for Medium and Bulk Volume Deposits
Carlsbad, CA, USA – March 2018 – Nordson ASYMTEK a Nordson company that supplies dispensing, jetting, and coating equipment and technologies, introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal […]