What’s In A Quality Plan and How It Works
Quality and cost are two of the top criteria most companies look at when seeking a contract manufacturer. The reasons are obvious. If your product doesn’t meet the definition of quality — defined by industry standards or the consumer — your product is doomed to failure. Every product development project — whether a new product […]
Gartner Survey Shows Growth in Marketing Budgets Stalled in 2017
Two-Thirds of CMOs Plan to Increase Digital Adverting Investment, Despite Spending Cuts Growth in marketing budgets has stalled after continued increases over recent years, according to a survey by Gartner, Inc. The survey found that marketing budgets hit a plateau in 2017 after three years of growth, with budgets falling from 12.1 per cent of […]
HELUKABEL USA, Inc. Breaks Ground on New U.S. Headquarters
HELUKABEL, one of the leading global manufacturers and suppliers of cable, wires and accessories, held a groundbreaking ceremony Thursday, November 9 for their new U.S. headquarters. The eight-acre property in the Oakview Corporate Park, 1201 Wesemann Drive, is located in the Chicago suburb of West Dundee. The initial buildout will be for a 75,000-square-foot facility […]
UltraSoC selected by Microsemi for growing RISC-V product range
UltraSoC has announced that Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, has licensed UltraSoC’s universal analytics and embedded intelligence platform for use in an expanding range of Microsemi products based on the RISC-V open source processor architecture. This latest engagement for UltraSoC extends a longstanding relationship with Microsemi. […]
ERNI OPTIMIZES BOARD AND WIRE CONNECTOR SOLUTIONS FOR INDUSTRIAL DRIVES AND CONTROLLERS
ERNI Electronics continues to support industrial automation by taking advantage of decades of electro-mechanical contact design and employing that experience in ruggedized factory applications. Industrial automation requires constant, highly reliable connectivity for high vibration environments. Miniaturization is also challenging interconnect solutions and options, but it does not imply foregoing electro-mechanical reliability and mating integrity in […]