RoHS Exemptions and Out-of-Scope: Approaches, Risks & Benefits Date: February 02, 2006 at 11:30am EST, attendance is free Duration: 60 minutes Speakers: Dan Shea, Chief Technology Officer, Celestica   Brian Toleno, Application Engineering Team Leader, Henkel   Jim McElroy, Executive Director/CEO, iNEMI Overview With the deadline for RoHS compliance only five months away, consumer electronics companies are currently in the midst of rolling out their implementation plans, while looking ahead to the deployment of similar legislation in China. Meanwhile, in anticipation of disruptions to the electronics supply chain, a number of forward-thinking companies with products in the 'out of the scope' or 'exempt' categories are busy assessing options or deciding whether to take the RoHS plunge. Others, however, are taking a riskier approach - either doing nothing; or struggling towards compliance while hoping for a legislative change that will provide them with both leniency and time. A dynamic speaker with a depth of technical knowledge and a 25-year tenure in the business of electronics manufacturing, Dan Shea, Chief Technology Officer, Celestica will discuss the risks and benefits of various approaches to product exemptions and out-of-scope status in the electronics industry today. This is a must attend event for all companies, whether your plan is to fully comply, to apply for an exemption, or to just convert your product and processes for 'future-proofing'. Dan Shea - Chief Technology Officer, Celestica Corp. Dan Shea has been Celestica's Chief Technology Officer since March 1998. He is responsible for all aspects of technology and engineering at Celestica, including overseeing Celestica's compliance with emerging environmental legislation such as the RoHS and WEEE, and Celestica's Green Services product conversion offering. He is also actively involved in professional and industry associations, including the International National Electronics Manufacturing Initiative (iNEMI), the Professional Engineers of Ontario, and the Advanced Design and Manufacturing Institute where he sits on the Board of Directors.   Jim McElroy, Executive Director and CEO, iNEMI Jim McElroy joined iNEMI as Executive Director and CEO in 1996. He came to iNEMI from MicroModule Systems, a 1992 spin-off from Digital Equipment Corporation. One of the founders of MMS, he initially served as the company's Business Manager for the eastern U.S. and Europe and, later, as Vice President of international operations. Prior to that, Mr. McElroy worked for Digital Equipment Corporation for 15 years, holding a number of technical and management positions in both engineering and manufacturing. Key assignments included operations management of Digital's multichip module factory in Cupertino, California, and program management of the physical technology development for the VAX9000 system (based in Marlboro, Massachusetts). Before joining Digital in 1976, he worked at RCA on packaging and interconnect design for military computer systems. Mr. McElroy has authored several papers and articles in the area of interconnect/packaging and holds one patent for the design of the VAX9000 Multi-chip Module. He is an active member of IMAPS and IEEE. He received a B.S.M.E. and an M.S.M.E. from Northeastern University in Boston, Massachusetts.  Brian Toleno - Application Engineering Team Leader, Henkel Brian J. Toleno is Application Engineering Team Leader with the electronics group of Henkel in Irvine, California. He holds a BS in chemistry and a PhD in analytical chemistry, and managed the EMPF's failure analysis laboratory in Philadelphia prior to joining Henkel. Brian chairs the IPC's underfill handbook committee (J-STD-030) and co-chairs the solder paste standards committee (J-STD-005). He is also program chair for IEMT 2005, and an active member of SMTA. His published works include a course on failure analysis for SMTA, two chapters for electronic engineering handbooks, and numerous papers for trade publications.