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WHITE PAPER BRIEF DESCRIPTIONS
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PCB Engineering Change Orders (ECOs) Cost Millions and there are Options -- Additive Circuits
Every electronics manufacturer has experienced a last minute ECO that causes costly delays. In some cases it’s a prototype that can’t be proven out or a new product introduction (NPI) that must be delayed. In other cases the ECO requires connections to fine pitch pads, vias or BGA pads. Most added SMT pads simply can’t be done. Perhaps hundreds or thousands of PCBs are in the supply chain and need modification. There are options!
Reflow Process Control Monitoring, and Data Logging -- Speedline Technologies
Due to the mix of both leaded and lead free production, greater care must be introduced to ensure proper reflow process control along with data logging for product traceability. Reflow profiles must be more precise in a lead free process since the reflow temperatures of the lead free materials can approach the temperature tolerance of some of the components.
Flux Application for Lead-Free Wave Soldering -- Speedline Technologies
Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is the fluxer system. This paper compares the more popular flux systems in terms of through hole penetration, coverage accuracy, cost level, maintainability, and chemical compatibility.
Process Development And Characterization Of The Stencil Printing Process For Small Apertures -- Speedline Technologies
The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing -- Speedline Technologies
For some years now, an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste "brick," for small apertures Meeting this criterion, in the stencil printing process, has been a constant concern as the volume consistency of the solder paste brick is among the most critical metrics in determining high yields in the assembly process.
Liquid Tin Corrosion and Lead Free Wave Soldering Background -- Speedline Technologies
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems.
Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies -- Speedline Technologies
The use of high velocity, heated air to remove residual water has become the predominant method for drying printed circuit boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing decreases, the effectiveness of direct blow-off drying is greatly diminished. Adding blower power or slowing process speed will improve drying performance, but increase operating cost, and may decrease throughput.
Why contract manufacturing in the United States makes all the sense in the world -- Technology Infrastructure Solutions
Outsourcing manufacturing production of electronic equipment to the Far East has become a reflex action on the part of many U.S. based Original Equipment Manufacturers ( OEM’s) who are apparently bedazzled by the region’s low labor rates. Hidden and not so hidden increased logistics and other costs, however, usually nullify labor savings thus resulting in higher Total Supply Chain expenses after the decision to off-shore production.
Why HALT is not HALT -- DfR Solutions
The use of the term 'Highly Accelerated Life Testing', better known as HALT, originated in the late 1980’s within two different sectors of the electronics industry. Gregg Hobbs developed the term to describe a sequential process of applying a variety of stresses to a product, either individually or in combination, to identify the weak links in the design. But as time has shown us, HALT is not HALT.
Temperature Dependence of Electrical Overstress -- DfR Solutions
Electrical overstress is typically defined as an over voltage or over current event with a duration exceeding 100 to 1000 nanoseconds and nominal durations of 1 millisecond that occurs while the device is in operation.
Qualifying for Moisture-Containing Environments -- DfR Solutions
Moisture sensitivity testing is a critical step in a best practice approach to ensuring product reliability.
Understanding PCB Production -- NexLogic Technologies
Understanding production contract manufacturing is important to OEM procurement when outsourcing PCBs. The main focus is on test coverage to assure the PCB undergoing production is fully tested according to OEM specifications. This can include functional test, flying probe, and in-circuit testing to assure test points are allocated at different critical locations on the board.
Understanding PCB Prototypes -- NexLogic Technologies
There is a vast difference between PCB production and PCB prototypes. Characteristics of a prototype line differ in several respects from those of a production line. Prototype line traits include quick turn capabilities, flexibility, easy GUI, quick changeover adaptability, higher technology level, proactive and trained staff, equipment, and capacity levels.
Pb-free Impact on PCB Purchasing -- NexLogic Technologies
Rather than re-inventing the wheel, we’ll concentrate on basic information you, as a buyer or purchasing agent, can use to make your life easier. The following information helps you to understand some of the key particulars involved in selecting Pb-free PCBs and their associated costs.
Design-For-Test Considerations For PCB Design -- NexLogic Technologies
The perennial question in electronics design and manufacture is: "How do I design a printed circuit board (PCB) so that it can be properly tested?"
Schottky Diodes -- DfR Solutions
Schottky diodes use a metal-semiconductor junction as opposed to the semiconductor junctions used in standard diodes. We will look primarily at the effects of temperature on forward bias voltage drop, capacitance, and reverse current leakage.
LED Failure Modes and Mechanisms -- DfR Solutions
Light Emitting Diodes are the wonder component of electronic devices. Blinking indicators and light sources in every color of the rainbow make the black boxes of our profession capable of communicating with their users.This article will summarize the function and construction of ordinary LEDs, indicate some common failure mechanisms, and introduce the basic fixes appropriate to each type of failure.
Bromide-Free Options for Printed Circuit Boards -- DfR Solutions
Flame retardants have been around since the Egyptians and Romans used alum to reduce the flammability of wood. Brominated flame retardants (BFRs) first experienced use after World War II as the substitution of wood and metal for plastics and foams resulted in materials that were much more flammable.
iNEMI Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products -- iNEMI
These recommendations are intended to minimize the risk of failures from tin whiskers. It is the consensus of the iNEMI User Group that pure tin electroplating presents a risk in highreliability applications, and that there are cost-effective alternatives available to minimize this risk.
iNEMI High-Reliability Task Force Position Statement on RoHS5 & RoHS6 Subassembly Modules -- iNEMI
The RoHS Directive, which goes into effect on July 1, 2006, bans or severely limits the use of six materials in "electronic and electrical equipment,"and lead (Pb) is one of those materials. However, the directive provides for exemptions for Pb-containing solders used in certain high-reliability electronics, such as telecom network infrastructure products. Other high-reliability applications, such as automotive electronics, are not covered by RoHS.
Lead-free and RoHS Implimentation - Questions from the Frontline - Part 4 -- Kester
July 1 has come and gone but the RoHS Directive hasn't gone away. In fact China is looking to implement its own version by March 1, 2007. This directive, the MII Methods Law still needs some clarification but will require testing of the product for banned substances, a test report and a label to accompany the product. This does seem to be much more demanding than its European equivalent.
Status of EU RoHS Exemptions -- Agilent
In this article the EU (European Union) RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) exemptions will be updated. Emphasis is placed on the exemptions proposed by the electronic industry and the exemptions granted by the EU Commissioner.
Lead-free hand-soldering - ending the nightmares -- Kester
Kester has been getting numerous calls in reference to hand-soldering with lead-free in recent months As companies transition over to lead-free assembly a certain amount of hand-soldering will always be there. An article from Tech Search International last year did say that in Asia where lead-free is highly used, hand-soldering was more of a problem than lead-free SMT or wave soldering.
Lead-free and RoHS Implimentation - Questions from the Frontline - Part 3 -- Kester
A new year has begun and the activity with lead-free has increased dramatically as engineers struggle with implementing the RoHS Directive, lead-free soldering and WEEE.
Lead-free and RoHS Implimentation - Questions from the Frontline - Part 2 -- Kester
As 2005 moves forward Kester is receiving a continuous flow of questions from assemblers transitioning to lead-free soldering and RoHS compliance for products destined to European markets. This article is a compilation of some of these questions and their associated answers.
Implementation of Pb-free solder paste in a real manufacturing environment - Case Study Two -- Henkel
In this study we scrutinize the lead-free process preparations of another well-known electronics manufacturer that we shall call 'Manufacturer Y'.
Glass in your Pocket -- Accuplace
Today's consumer is demanding more from their hand held electronic device than ever before and this trend shows no sign of slowing. Since the display is the primary point of focus for the consumer in a mobile phone, many devices are now utilizing glass lenses to improve the user experience compared to that which traditional polycarbonate lenses offer. Benefits include improved optics, decoration possibilities, and smaller thickness.
Implementation of Pb-free solder paste in a real manufacturing environment - Case Study One -- Henkel
There has been much discussion in these columns about planning for RoHS compliance and the effects that changing to lead-free manufacture may have upon processes and equipment requirements. At this stage, it may be valuable to review some case studies from manufacturers that have already successfully conducted their testing and are proceeding to full implementation.
Lead-free and RoHS Implimentation - Questions from the Frontline -- Kester
As 2005 moves forward Kester is receiving a continuous flow of questions from assemblers transitioning to lead-free soldering and RoHS compliance for products destined to European markets. This article is a compilation of some of these questions and their associated answers.
The Effects of Pb-free Solder Paste Formulation on Voiding in Reflowed Assemblies -- Henkel
It's generally accepted that voids in solder joints are more common in Pb-free assemblies. While a very low amount of voiding may have little detrimental effect, a limit on the acceptable level of voids has never been established, thus the safest course of action is to strive for their elimination.
Reflow Process Control Monitoring, and Data Logging
Formulation Considerations for Automated Dispensing of Lead Free Solder Paste -- Asymtek
Dispensing solder paste with automated dispensing equipment provides many challenges that must be overcome before a production process can be considered robust. This paper outlines the important process parameters that must be determined and controlled for good production robustness, including the selection of valve or pump technology, selection of dispensing needles, selection of solder paste packaging, generic equipment settings, and paste formulation.
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces -- Asymtek
The range of devices underfilled has been greatly expanded and now includes everything from very small silicon devices to stacked die assemblies, MEMS and display devices. All of these applications have the common problem of smaller amounts of space restrictions/area, etc. that underfill materials can be applied to.This paper will describe the work done to develop a jet capable of dispensing abrasive underfill materials, producing smaller fillets and high throughput.
Optimizing Flip Chip Substrate Layout for Assembly -- Universal Instruments Corp.
Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards (e.g. in pad sizes and locations, mask registration, etc.), as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. This paper discusses these predictions and the trends they reveal.
Precision Flux Deposition Techniques for Semiconductor Applications -- Ultrasonic Systems
Significant improvements in flux deposition control can be achieved with an advanced ultrasonic spray technology that provides precise control of the spray pattern and film thickness.
Connector and Chip Vendors Unite to Produce a High-Performance 10 Gb/s NRZ-Capable Serial Backplane -- Teradyne
This document highlights some of the obstacles to 10 Gb/s data transmission over a copper backplane and describes breakthroughs in chip design, connector technology, and PCB manufacturing that, when used in synergy, can improve channel performance.
Electronics Manufacturing Glossary -- Surface Mount Technology Association
A glossary of acronyms to help you get through the alphabet soup of electronics manufacturing.
The History of SMT -- Surface Mount Technology Association
A historical perspective on the drivers and the creation of surface mount technology in the electronics industry.
The KIC 24/7 -- KIC
This paper will focus on recent advances in thermal process control and detail new methods for continuous automated process control. These advances maximize efficiency, minimize costs, improve yields and improve product quality.
Lead-free Reliability - Building it right the First Time -- Kester
Lead-free assembly and RoHS will bring about numerous changes and the number of variables with which to contend is increasing, creating increased risk of defects and reduced product reliability. However, understanding what the variables are and their impact on the assembly can great increase product reliability.
Sn-Pb Wetting to Pb-free Components: Designing Reliability into the Process -- Henkel
For a long time, a common complaint when initiating the changeover to lead-free electronics manufacturing was the poor availability of lead-free components. But now that component manufacturers have caught up with the rest of the lead-free movement, the opposite situation is more likely today: there is a high probability that Pb-free components will be used in Sn-Pb processes.
Lead-free Wave Soldering - Some Insight on How to Develop a Process that Works -- Kester
As lead-free gains momentum, many engineers are striving to set-up a wave solder process that maintains production yields but also offer reliable assemblies. This paper examines the key elements in establishing a reliable wave operation and tries to answer the following question in some depth.
Lead-free Defects in Reflow Soldering - How to Prevent Them -- Kester
The IPC-610D Acceptability of Electronic Assemblies will shortly be available and Section 5. Soldering will include information on acceptable and defective lead-free solder joints. Lead-free SMT can be challenging however, this challenge can be reduced if the basic changes associated with this transition are clearly understood. Both paste selection and the reflow process will need to be catered to.
Lead-free SMT - Considerations in Developing a Reliable Soldering Process
-- Kester
Lead-free SMT can be achieved reliably if several process requirements are implemented carefully but a solid understanding of the changes, which will occur during the lead-free transition, is needed.
Pressure Sensitive Adhesives: A Blueprint for Maturity -- Accuplace
The use of adhesive backed components is steadily growing as a method for assembling much of today's technology. Computers, mobile phones, and handheld electronic devices all employ adhesive components in numerous instances. Labels, insulators, shields, and screens are just a few examples of the components used. While this trend is improving product performance, the lack of standardized assembly platforms inhibits the adoption of adhesive technology and its broad-based acceptance.
The Challenges of Testing Low Voltage Technologies at In-Circuit Test -- Teradyne
This paper discusses the challenges of performing powered-up vector testing of low voltage technologies on In-Circuit testers and the safeguards that are necessary to ensure that test vectors do not violate the increasingly tight specifications of low voltage parts. |
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Fluid Dispensing Capabilities for Assembly of MEMS -- Asymtek
The automated dispensing equipment that is used in electronics assembly and packaging is well suited for many MEMs devices. Various technologies are discussed for making small dots of materials, small lines, and film coating. Some examples of fluid dispensing for MEMs are given.
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From Batch to Breakthrough -- Understanding Phase Convection Technology -- VI Technology
Phase convection is a real revolutionary breakthrough in soldering and curing technology which the industry has been waiting for to meet the challenges of throughput, floor space and of course the environment. As the technology is also able to handle much higher temperatures without added contamination, it is ideal for lead-free soldering.
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Measurements Support the Candidacy of PTFE at High Data Rates -- Teradyne
A growing need is developing in the high speed digital arena (backpanels, motherboard, line cards etc) for high performance laminate, prepreg materials, connectors, intelligent routing of differential pairs, and other strategies to improve signal integrity at the 10gbps range. |
The Zero Defect SMD Assembly Line: Advances in AOI -- VI Technology
Gray scale correlation is giving way to new technologies such as Vectoral Imaging. These new methods of identifying and inspecting components during PCB assembly are solving major drawbacks such as time needed to program, program transportability and reliability.
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Soldering 101 -- Indium Corporation of America
A primer providing a basic understanding of the soldering process. This paper discusses the basics of soldering material, process, and metallurgy.
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Plasma Modes: Primary and Secondary Plasmas -- March Plasma Systems
There are two basic types of cold gas plasma: 'primary' (or 'direct') plasma and 'secondary' (or 'indirect') plasma. Secondary plasma is also commonly referred to as 'downstream' or 'remote' plasma. The strengths and limitations of each type are addressed.
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