All Listings Brief Descriptions Submission Info   WHITE PAPER LISTINGS PCB Engineering Change Orders (ECOs) Cost Millions and there are Options   -- Additive Circuits Flux Application for Lead-Free Wave Soldering   -- Speedline Technologies Process Development And Characterization Of The Stencil Printing Process For Small Apertures   -- Speedline Technologies Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing   -- Speedline Technologies Reflow Process Control Monitoring, and Data Logging   -- Speedline Technologies  Liquid Tin Corrosion and Lead Free Wave Soldering Background   -- Speedline Technologies Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies   -- Speedline Technologies Why HALT is not HALT --  DfR Solutions Temperature Dependence of Electrical Overstress  --  DfR Solutions     Qualifying for Moisture-Containing Environments  --  DfR Solutions Understanding PCB Production - - NexLogic Technologies Understanding PCB Prototypes - - NexLogic Technologies Pb-free Impact on PCB Purchasing - - NexLogic Technologies Design-For-Test Considerations For PCB Design - - NexLogic Technologies  Schottky Diodes - - DfR Solutions LED Failure Modes and Mechanisms -- DfR Solutions Bromide-Free Options for Printed Circuit Boards -- DfR Solutions iNEMI Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products  -- iNEMI iNEMI High-Reliability Task Force Position Statement on RoHS5 & RoHS6 Subassembly Modules  -- iNEMI Lead-free and RoHS Implimentation - Questions from the Frontline - Part 4  -- Kester Status of EU RoHS Exemptions   -- Agilent Lead-free hand-soldering - ending the nightmares   -- Kester    Lead-free and RoHS Implimentation - Questions from the Frontline - Part 3  -- Kester Lead-free and RoHS Implimentation - Questions from the Frontline - Part 2  -- Kester Implementation of Pb-free solder paste in a real manufacturing environment - Case Study 2 -- Henkel Glass in your Pocket  -- Accuplace Implementation of Pb-free solder paste in a real manufacturing environment - Case Study 1 -- Henkel Lead-free and RoHS Implimentation - Questions from the Frontline  -- Kester The Effects of Pb-free Solder Paste Formulation on Voiding in Reflowed Assemblies  -- Henkel Lead-free Reliability - Building it right the First Time  -- Kester Sn-Pb Wetting to Pb-free Components: Designing Reliability into the Process  -- Henkel Lead-free Wave Soldering - Some Insight on How to Develop a Process that Works  -- Kester Lead-free Defects in Reflow Soldering - How to Prevent Them   -- Kester Lead-free SMT - Considerations in Developing a Reliable Soldering Process   -- Kester Pressure Sensitive Adhesives: A Blueprint for Maturity -- Accuplace The Challenges of Testing Low Voltage Technologies at In-Circuit Test  -- Teradyne Formulation Considerations for Automated Dispensing of Lead Free Solder Paste -- Asymtek Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces -- Asymtek Optimizing Flip Chip Substrate Layout for Assembly -- Universal Instruments Corp. Precision Flux Deposition Techniques for Semiconductor Applications -- Ultrasonic Systems Connector and Chip Vendors Unite to Produce a High-Performance 10 Gb/s NRZ-Capable Serial Backplane --  Teradyne  Electronics Manufacturing Glossary -- Surface Mount Technology Association The History of SMT -- Surface Mount Technology Association The KIC 24/7 -- KIC Finding the Best Oven Recipe w/the SlimKIC 2000 and the Auto-Focus Software Option -- KIC Fluid Dispensing Capabilities for Assembly of MEMS -- Asymtek From Batch to Breakthrough -- Understanding Phase Convection Technology  -- VI Technology Measurements Support the Candidacy of PTFE at High Data Rates -- Teradyne The Zero Defect SMD Assembly Line: Advances in AOI -- VI Technology Soldering 101 -- Indium Corporation of America Plasma Modes: Primary and Secondary Plasmas -- March Plasma Systems