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Archive August 2005

 
Agile CEO to participate at 2005 Automotive Management Briefing Seminars TODAY
Agile Software receives high scores in Recent AMR research report
BenQ concentrates resources on three major business categories
BenQ wins super-multi DVD burner order from TEAC
China sales help win Queen's Award for PCB specialist Trackwise
CTS reports Q2 - repatriates $50 million cash under the American Jobs Creation Act of 2004
Dominique Numakura's Newsletter from Japan
High-speed backside wafer coating process from DEK
New flip chip underfill now available from Henkel
Notebook sales in China and India to drive 2005 growth, according to Toshiba
PCB maker Unimicron reports on-year slide in 1H profits
Q2 results for 2005 published by WSTS
Solectron to present at RBC Capital Markets North American Technology Conference
TSMC reportedly lands Microsoft's foundry contract for Xbox360 chips
ZESTRON America to exhibit at West Penn SMTA Vendor Show
Asustek wins contract notebook PC order from HP
CirTran's Racore subsidiary continues to build government business
DDi Corp. to announce Q2 results on August 2
Dr. Jennie Hwang to deliver lead-free lectures
Henkel names new Technical Director of RD&E for Material Sets
High tech products account for 27% of China's exports in 1H 2005
JTAG Technologies announces brand new handbook for boundary-scan beginners
Mark Vininski Joins the KIC Team
Orbotech announces Q2 - revenue and income up over last year
Reptron announces election of two new board members and resignation of two board members
Speedline appoints Product Managers
Ultrasonic Systems wins best cost-of-ownership
Valor shows revenue growth for the ninth consecutive quarter
With first WEEE deadline looming, Arrow Electronics provides easy-to-use guide for manufacturers
Worldwide semiconductor sales up by 6.5 percent in first half of 2005
Agilent adds S-parameter measurement capability on DCA-J
Agilent and Speedline to collaborate on Lead-Free-Manufacturing experiments
Aspocomp CEO's review and business goals
Aspocomp's Q2 Interim Report
Asustek lands notebook orders from NEC, says paper
DDi Corp. reports Q2
Elcoteq Americas names Miguel Andres as Business Development Director for Latin America
Elcoteq's Interim Report January-June 2005 (unaudited)
EPIC facilities certified to two key quality standards
High tech products account for 27% of China’s exports in 1H 2005
iSuppli CEO to keynote system-on-chip conference
Joseph Cumbey joins Dynatech Technology
New Western region sales manager for Dynatech
Stock options exercised to subscribe for Elcoteq shares and increase in share capital
THT Research - Weekly Newsletter from Taiwan
Visiprise receives $16 million in new funding
Adeon Technologies announces sale of drilling/routing machine to Epigem
Automated DIMM Rework with the Fineplacer HVR
AVX Corporation honoured by ULT with ultimate supplier award
Celestica completes cash tender offer
Change of address for Westwind Air Bearings Suzhou Co. Ltd.
Compal asks handset component suppliers to reduce quotes 5% per quarter
DuPont and Sanmina-SCI sign licensing agreement
Full Service EMS solution in Europe for Europe
Indium announces new VP of Marketing
iNEMI schedules Innovation Leadership Forum September 15-16
IPC announces agendas for Fall Management Council Meetings
Nortech reports Q2 results
Phillips Semiconductor to take HQ to China
Speedline Technologies announces lead-free enhancements
Split line/multi-function conveyor introduced
Automated DIMM rework with the Fineplacer HVR
Celestica acquires CoreSim
Celestica acquires Ramnish Electronics
CirTran's Racore subsidiary ships products to Disney World
Compal posts first profit increase in six quarters
Dover Corporation Increases Quarterly Cash Dividend
Fine-pitch printer with vision from ESSEMTEC
Inventec and Asustek look to boost market share
Popularity of entry level phones drives 16.3% growth in shipments, IDC finds
SMTA calendar of events announced
Sypris reports Q2 - revenue up 31%
Universal Instruments and Selettra confirm plans to extend partnership
Adapting for survival - TMRC Conference now open to non-members
Agile announces partnership with xPLM Solution
Agile solutions implemented at Haemonetics
Asustek grabs Sony notebook order, says paper
Compal aims to ship 300,000 flat panel TVs in 2005
Dominique Numakura's Newsletter from Japan
Dover Corporation Acquires Colder Products Company
Kester and ZESTRON perform tests during combined workshop
Kester University offers lead-free assembly and rework training
Seminar to be offered by Asymtek and Emerson & Cuming
Ya Hsin breaks into low-price handset markets with MediaTek chips
AT&S makes acquisition in India
Dage announces new East Coast Demonstration Center and Applications Lab
Elektrobit combines business units
Grant Aldonas to address IPC Management Council Meeting attendees
Ibiden to Boost Output of PCBs for Cell Phones
IPC and EIPC to co-host conference
Mr Reliability presents Solder Joint Master Class at NPL
NPL announces two winter conferences
PKC Group to cut up to 230 jobs
Proceedings of Electronics Assembly SSTC Conference now available
Speedline Technologies announces lead-free upgrades
Taiwan's computer output value rose 23.4% in first half
THT Research - Weekly Newsletter from Taiwan
Agile and PRTM to hold environmental compliance discussion
Agilent to host webcast of Q3 financial results conference call
AMI Semiconductor selects Teradyne FLEX test platform
Anne McKerrow promoted at Indium Corporation
Compal Communications raises 2005 handset shipment forecast
ECA order index takes July jump
EMS maker Cal-Comp lowers its 2005 revenue projection
ESI receives order from Efficere Technologies for UV Laser Drilling System
FEINFOCUS and INNOV-X Systems Announce Technology Alliance
FIMI funds to invest US$5 m in Camtek
iSuppli enhances EMS/ODM research program
Japanese Inventors Develop Copper Foil with Carrier US Fed News
Obducat enters into agreement with Samsung Electronics
Powerful platform fusion at ATExpo 2005
Samsung to lose its only ODM notebook client, Dell
Sanmina-SCI to license Buried Capacitance(R) Technology to Dupont
Solectron chosen to manufacture Wyse Technology's Thin Client Product Line
TSMC, UMC July sales up over June, down from 2004 Aspocomp look to reduce head count at Salo unit
Expanded conference program to cover market- and future-oriented topics at Componex/electronicIndia 2006
Filtronic plc sell of handset products division to Technitrol, Inc
First-tier mobo shipments up 15.8% on year in July
HTC to manufacture Microsoft-based Treo smartphones for Palm, report says
Industrial firms say spending increases may ease in 2005's second half versus 2004
Less is more for Apple's Mac mini
Minco chooses Printar digital legend printing system
Nordson Q3 revenue up 2%
NOTE release interim report, January - June 2005
Panasonic Systems to reduce handset contracts to Taiwan
SMTA Vendor Days in DC, Dallas and Wisconsin
Speedline Technologies to introduce new dispensing system to Asia
Taiyo America appoints Technica, USA as Western region distributor
TSMC wants to build Taichung fab
Universal Instruments designs advanced assembly line

Wistron to sell AOpen shares
X-Line Asset Management to hold second quarterly auction August 16-17, 2005
Another Nordic PCB bankruptcy
Asymtek signs distributor agreement with Kankun Trading Company
Axiom contract win boosts manufacturing jobs in Wales
Camtek announces 2005 Q2 results
DEK to showcase mass imaging solutions at Productronica 2005
First-tier mobo shipments up 15.8% on year in July
Flextronics and Raymarine enter into five year outsourcing relationship
Gary Usyk joins Indium Corporation
Hon Hai saw sales top NT$322 billion in first seven months
NAND flash memory revenue exceeds NOR again in Q2
PSC-invested PCB maker MaxEdge Electronics to terminate production in September
Sanmina-SCI licenses Buried Capacitance(R) Technology to ISU Petasys
THT Research - Weekly Newsletter from Taiwan
Acer expects to ship 10 million notebooks in 2006
Calumet Electronics purchases new Schmid S/E/S line
Compal raises millions selling bonds
Eltek reports 2Q05 financial results
Foresite announces locations for fall workshops
Kitron receives medical order
OEMs to reclaim procurement from EMS firms DAN HAWTOF
Rogers Corp. to show high frequency circuit materials at Antenna Systems Show ‘05
TSMC looking to expand Spansion partnership
ZESTRON America announces new Technical Sales Manager for Mexico
Asia-Pacific computer sales up 18% in first six month
Benchmark Electronics deploys Kinaxis RapidResponse solution
CeTaQ Americas marks first year in business
China-based Lenovo Mobile ships one million handsets in 2Q
CirTran calls countersuit 'Frivolous, Fraudulent, Intentionally Inflammatory'
CirTran reports 123% increase in sales and 11% net profit in 10Q Filing
Dominique Numakura's Newsletter from Japan
ECI Introduces QualiSurf(TM) wet processing solution analyzer for sub-90 nm technologies
Jeroen L. Schmits assumes presidency of Universal Instruments
Making the transition to lead free easier
Park announces resignation of its SVP, Marketing and other changes in officer positions
Reptron reports extension of filing Form 10-Q
Sampo introduces 32-inch LCD TV priced less than US$1000
Seica announces S40 Pilot
Sercel and von Dadelszen of JPSA publish chapter in laser beam shaping book
SMTC reports Q2 - revenue up and return to profitability
Technology Forecasters announces new corporate sponsor and quarterly forum members
Universal Instruments and Selettra confirm plans to extend partnership
Viasystems announces new office of Chief Compliance Officer
AAT combines best of two cleaning systems to create new Hi-rel cleaner
Brigadier General Nick Halley to speak at NEDA event
Cobar Introduces Robust, Stable Water-Soluble Solder Paste
Genius Electronic aims to ship 45 million cameraphone lens units this year
Goldman Sachs downgrades motherboard shipment estimates for 3Q
HP takes top spot in 2Q printer shipments
Intel Capital boosts investment in China
IPC and CCA host Boot Camp - Lead Free Requirements for U.S. Electronic Equipment
OS-TECH announces Univar, Inc. & Mustang Industries, Inc. distribution agreements for California
Rohm and Haas and JSR settle patent litigations
Seica present S40 at the XIAN Defence Show China, booth # A1/091
SM-700 plastic belt conveyor introduced

Assembleon, Asymtek, Mydata, Siemens, Transition Automation






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