Alpha to Present Technical Papers at Several Industry Forums in Shenzhen, China
Aug 15, 2014
Alpha, the world leader in the development and production of electronic soldering materials, will attend several key industry events this month in Shenzhen, China where Andy Yuen, Technical Services Director – Alpha Southern China, will be presenting technical papers.
The first paper, “Development of Low-Temperature Drop Shock Resistant Solder Alloys for Handheld Devices” will be presented at the iNEMI Workshop on Board Assembly & Test Technology (25 August 2014) and at the 2014 China Solder Technology Forum (27 August 2014). As handheld devices become increasingly smaller and complex, Andy will present Alpha’s findings on Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering.
Next, Andy will explore the “Development of a Fatigue Resistant Lead-Free Alloy for High Reliability Under Hood Applications” to be presented at the SMTA China South Technology Conference (26 August 2014). This paper explains the development of a high performance alloy designed to withstand the harsh conditions within the tough reliability requirements mandated by vehicle manufacturers.
“It is important for OEM, EMS, equipment and material suppliers to meet and discuss the technological challenges we face in the industry,” said Andy Yuen. “Our collaborative efforts can aid in identifying best practices for assembly and testing which could lead to future standards and processes that will shape future product developments”.