WHITE PAPER - Voiding Reduction in Bottom Terminated Components (BTC) with Improved Flux Coating
By Seth Homer and Ronald C. Lasky, PhD, PE
Jul 08, 2014
Voiding reduction is a critical challenge in modern electronics assembly, especially for bottom terminated components (BTCs) such as QFNs (quad-flat no-leads). Excessive voiding inhibits heat transfer between the thermal pad on the QFN and the PWB pad. Flux-coated solder preforms have been shown to significantly reduce voiding. Recent work has shown that improving the flux coating on solder preforms can further reduce voiding. This paper describes this work.
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