BTU International and Partners Present Assembly Process Workshop
Sep 18, 2013
BTU International, Inc. has announced that it will present a workshop in conjunction with Koh Young Technology, Juki Corporation and Speedline Technologies. The free workshop will be hosted by ACI Technologies and will take place October 2-3, 2013, in Philadelphia, PA.
The workshop will address the importance of solder paste inspection (SPI) for
reliability, advances in accuracy and speed in pick-and-place machines, including package on package (PoP), mastering proper soldering techniques with reflow ovens, and precision stencil printing.
Mastering solder paste reflow profiles is usually the last step to locking down the SMT assembly. Fred Dimock from BTU will discuss the development of reflow profiles for PCB solder reflow, semiconductor packaging, and lead-free processes.
Fred Dimock is the Manager of Process Technology at BTU International in Massachusetts. He holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelor's Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). His extensive experience in thermal processing includes positions at Corning, General Electric, and Osram-Sylvania before joining BTU.