Engineered Material Systems Introduces DF-1014 Dry Film Negative Photoresist
Apr 05, 2013
Engineered Material Systems, Inc. introduces the DF-1014 Dry Film Negative Photoresist for use in Micro-Electro-Mechanical Systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-1014 is available in various thickness formats from 5-50
μm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-1014 film is tougher (less brittle) than most negative photoresists in the market with a glass transition temperature of 145°C (by DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25C. The cured chemistry is hydrophobic in nature, providing for chemical and moisture resistance.
DF-1014 is compatible with and can be used in contact with the EMS line of spin coatable photoresists. DF-1014 is the latest addition to Engineered Materials Systems' full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.