Test Interface Boards - Customers Appreciate Multitest Pulse Plating Process for Board Fab
Aug 21, 2012
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, is pleased to announce that its Pulse Plating Process grants significant advantages in terms of fabrication cost and cycle time. Multitest Pulse Plating has been released to manufacturing for all
major board customers. The proprietary Multitest process has proven market-leading performance in various customer applications.
Originally the process was developed to support ultra high aspect ratio requirements at 0.4 mm pitch. Multitest has developed a customized plating process for small via diameters in high layer count PCBs used in ATE test. The process allows for .0051" diameter through-holes into PCBs with up to 40 layers.
The Multitest Pulse Plating Process is applied particularly to BGA and WLCSPs as well as for vertical probe applications. It eliminates the need for sequential lamination in most 0.4mm pitch applications. This same technology is deployed for 0.3mm pitch BGA applications with through-hole construction.
For more information, please visit www.multitest.com/pcb