Flextronics VP to Keynote Indium Corporation-, DEK-, and OK International-Sponsored Technical Seminar in Shenzhen
Aug 17, 2012
You are invited to join Indium Corporation, DEK, and OK International at a technical seminar:
• Futian Shangri-La Hotel
• Shenzhen, China
• August 27, 2012
• 10:00AM to 5:00PM
The seminar, Maximise Yields, Miniaturise Innovations, will feature:
• A keynote address by:
o Murad Kurwa, Vice President of Engineering at Flextronics
o Topic: The SMT Industry in 2012
• High-level technologists and engineers addressing cutting-edge technologies for the PCB assembly industry:
o Indium Corporation
o DEK
o OK International
Featured speakers and topics include:
• Li Yi, Solutions Engineer and Mait Chang, Solutions Engineer from DEK- Future Proofing for Your Process with Value Added Equipment and Productivity Tools
• David Hu, Technical Manager in China from Indium Corporation – Establishing a High Yield Lead-Free Assembly Process with a Broad Process Window
• Vincent Goh, Regional Sales Manager-Central China from OK International – Challenges for Reworking 01005 Components
• Jim Wong, Franchise & Licensing Manager and Rick Goldsmith, Global PSP Manager from DEK – Novel Solution to Regain High Yield Processing Within an SMT Environment
• Ning-Cheng Lee, PhD, Vice President of Technology from Indium Corporation – Soldering Materials Crucial for High Yield and High Reliability for SMT Assembly
• Paul Wood, Advanced Application Manager and Vincent Goh, Regional Sales Manager-Central China from OK International – Rework Challenges for LGA/QFN Packages
The seminar will conclude with a panel discussion with representatives from Flextronics, DEK, Indium Corporation, and OK International.
Please RSVP your attendance to Tracey Khoo at tkhoo@dek.com.
www.indium.com
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