SMTA Announces Lead-Free Soldering Technology Symposium Schedule at SMTA International
Aug 01, 2012
The SMTA has announced that the Lead-Free Soldering Technology Symposium will be held on October 18, 2012 as a focused symposium at SMTA International in Orlando, FL. The scope of this year's symposium relates to the findings of the iNEMI consortium, which examined the reliability of several new Pb-free solders as well as the results of the Pb-free Electronics
Risk Management (PERM) consortium efforts addressing the impact of Pb-free solutions on high-reliability electronics that are built for military, space, and avionic applications.
The first session will cover the iNEMI Pb-Free Alloy Characterization Project Report: Thermal Fatigue Performance. The second and third sessions will function as a workshop on Dependable Electronics with Lead-Free Components/Systems built into the symposium. The fourth session is Lead-Free Solder Joint Reliability: Meet the Experts.
Papers will be presented by speakers from Alcatel-Lucent, Auburn University, Amkor Technology, Hewlett-Packard, iNEMI, Lockheed Martin, Raytheon Company, and Rockwell Collins among others.