Nordson DAGE Named 2012 Best of West Finalist for New X-Plane™ Technology
Jul 03, 2012
Nordson DAGE has been selected as a Best of West finalist for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option. SEMI and Solid State Technology Magazine will announce the winner of the 2012 Best of West Award Program on Wednesday, July 11, 2012.
X-Plane™ is a
revolutionary option for Nordson DAGE's range of industry-leading X-ray inspection systems that uses a proprietary, patent applied for tomosynthesis, or CT technique, to create 2-D X-ray slices in any plane of a printed circuit board assembly, without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane™ technology is quick, simple and easy-to-use.
The board is placed in the Nordson DAGE X-ray inspection system and oblique-angled X-ray images are taken 360° around the region of interest. X-Plane™ shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.
Presented by SEMI and Solid State Technology Magazine, the Best of West Award recognizes important product and technology developments in the microelectronics industries. Winners will be selected by an independent panel of highly qualified judges. Best of West finalists and award recipients will be selected based on the submission's financial impact on the industry, engineering or scientific achievement, or societal impact and benefits.