Nihon Superior to Debut New Low-Voiding Lead-Free Solder Paste
Jun 26, 2012
Nihon Superior will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.
When reflowed with SN100C P810 D4 large-area solder joints, such as those
between power semiconductors and their substrates, there is a lower incidence of voiding than if reflowed with conventional lead-free solder paste. While delivering low voiding, this high-reliability lead-free solder paste also is formulated to deliver excellent reflow with minimum mid-chip balling and exhibits excellent wetting on all common substrates. Our test results indicate that when used in combination with vacuum reflow, this paste can produce solder joints on 19x19 mm pads and joints to power transistors with less than 1 percent voiding.
SN100C P810 D4 is based on Nihon Superior's well known silver-free and lead-free solder alloy SN100C®, which has a track record of more than 13 years of successful delivery of high productivity and high reliability. SN100C is a compliant alloy with high impact strength and has a cost advantage over alloys containing silver. It can be reflowed with profiles similar to those commonly used with alloys such as SAC305 and SAC405.