Panasonic to show unique total solution package at Semicon
Jun 21, 2012
Panasonic Factory Solutions Company of America will highlight its unique total package solution for microelectronics manufacturers in booth 6471 at Semicon West at the Moscone Center in San Francisco, CA July 10-12.
Known for world-class quality, innovation, and industry-leading products, systems, and
solutions, Panasonic will show booth visitors examples of materials, processes, and manufacturing execution system software solutions. Panasonic's evolving materials will include a collection of NS-LTCC (Non-Shrink Low Temperature Co-fired Ceramic) and ALIVH (Any Layer Inner Via Hole) substrates enabling fine patterns, high density routing and thinner packaging. Featured process solutions will include the MD-P200, for high-productivity bonding, and plasma solutions for singulation and cleaning.
Product experts will be on hand to discuss how being a product developer, material supplier, equipment vendor, process expert, manufacturing execution system provider, and leading electronics manufacturer endows Panasonic with incredible value-add for microelectronics manufacturers. Visit www.panasonicfa.com/Semicon12 to get more information.