NEW WHITE PAPER - Wave Soldering Adapts with New Flux Technology
By Mark Currie, Ph.D., Henkel Electronic Materials LLC
Jun 18, 2012
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While the methodologies and the function of the wave soldering process have been relatively stable for some time, the expectations of what it needs to achieve have become far more demanding. As assembly technology has evolved, the wave soldering process has also had to embrace all of these changes and adapt.
Technologists now want a process that delivers everything including a wide process window, improved speed, better through hole penetration, capability with multiple surfaces, lead‐free and tin‐lead capability and one that does all of this reliability and consistently. Central to the success of wave soldering performance is the capability of the flux system, which must also embrace all of the technology requirements of modern manufacturing.
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