ECM to Showcase Snap Cure Low-Cost Conductive Adhesives for Interconnecting Solar Cells at Intersolar NA 2012
Jun 15, 2012
Engineered Conductive Materials, LLC will exhibit the new low temperature curing Conductive Adhesive DB-1541-LTC in North Hall, Booth #5619 at the upcoming Intersolar North America conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
ideal for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV). This material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 100°C or higher.
The DB-1541-LTC adhesive can be cured as low as 100°C, but has a dispensing work life greater than 48 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. The DB-1541-LTC features a rubber-like flexibility that is ideal for flexible applications with high peel strength to withstand the stresses induced in reel-to-reel manufacturing processes. This material also can be fast cured at elevated temperatures (1minute @ 180°C)