NuSil Technology presents new easy-to-use film adhesive with low outgassing

Film adhesive and activator duo requires no mixing or deairing.

NuSil Technology LLC announces the release of CV-2681-12, an electrically conductive, controlled volatility (low outgassing) film adhesive designed for a wide range of applications, from tacking down wires to working with solar cells and mirrors.

Static-dissipative with controlled volatility, CV-2681-12 is ideal for electronics and space applications that require minimal outgassing in sensitive applications (e.g., satellites). On average, its volume resistivity measures 125 ohm.cm. This film adhesive can be die cut and has, approximately, a .012 inch controlled bond line for consistent bond thickness. A space-grade material, CV-2681-12 can maintain adhesion in a broad range of temperatures, making it suitable for RFI and EMI shielding in electrical space applications or, more generally, for applications in which temperature is a concern.

Simple to use, CV-2681-12 is a room temperature vulcanizing (RTV) adhesive and, therefore, does not require heat to cure. This two-part material consists of HCR sheeting reinforced with a mesh and a separate catalyst, known as the "activator," to induce curing.

"CV-2681-12 requires no mixing and no deairing before using," said Brian Burkitt, Product Director - Engineering Materials. "Once the priming activator has been applied to the substrate, peel the adhesive from the backing and stick it on the prepared surface." 

CV-2681-12 meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A, and the European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%.

For more information on NuSil's silicones for engineering applications, call 805-684-8780 or visit http://www.nusil.com/products/engineering/index.aspx.